US Patent Issued to Taiwan Semiconductor Manufacturing on April 1 for "Polymer material in a redistribution structure of a semiconductor package and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,265,330, issued on April 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Polymer material in a redistribution structure of a semiconductor package and method of manufacture" was invented by Sih-Hao Liao (New Taipei, Taiwan), Yu-Hsiang Hu (Hsinchu, Taiwan), Hung-Jui Kuo (Hsinchu, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device includes applying a polymer mixture over a substrate, exposing and developing at least a portion of the polymer mixture to form a developed dielectric, and curing the developed dielectric to form a dielectric ...