US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 1 for "Pellicle for an EUV lithography mask and a method of manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,265,323, issued on April 1, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Pellicle for an EUV lithography mask and a method of manufacturing thereof" was invented by Tzu-Ang Chao (Hsinchu, Taiwan), Chao-Ching Cheng (Hsinchu, Taiwan) and Han Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pellicle for an EUV photo mask includes a first layer; a second layer; and a main layer disposed between the first layer and second layer and including a plurality of nanotubes. At least one of the first layer or the second layer includes a two-dimensional material in which one or more two-dimensional layers a...