US Patent Issued to Taiwan Semiconductor Manufacturing on April 1 for "Method of fabricating semiconductor package" (Taiwanese Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,639, issued on April 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of fabricating semiconductor package" was invented by Hao-Yi Tsai (Hsinchu, Taiwan), Cheng-Chieh Hsieh (Tainan, Taiwan), Tsung-Hsien Chiang (Hsinchu, Taiwan), Hui-Chun Chiang (Hsinchu, Taiwan), Tzu-Sung Huang (Tainan, Taiwan), Ming-Hung Tseng (Miaoli County, Taiwan), Kris Lipu Chuang (Hsinchu, Taiwan), Chung-Ming Weng (Taichung, Taiwan), Tsung-Yuan Yu (Taipei, Taiwan) and Tzuan-Horng Liu (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a first semiconductor die, a second semiconductor die, a ...