US Patent Issued to Taiwan Semiconductor Manufacturing on April 1 for "Integrated devices in semiconductor packages and methods of forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,619, issued on April 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated devices in semiconductor packages and methods of forming same" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Kai-Chiang Wu (Hsinchu, Taiwan), Chung-Shi Liu (Hsinchu, Taiwan), Shou Zen Chang (Hsinchu, Taiwan) and Chao-Wen Shih (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment package comprises an integrated circuit die encapsulated in an encapsulant, a patch antenna over the integrated circuit die, and a dielectric feature disposed between the integrated circuit die and the patch antenna. The patch antenna ove...