US Patent Issued to Taiwan Semiconductor Manufacturing on April 1 for "Die stack structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,637, issued on April 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Die stack structure and manufacturing method thereof" was invented by Hsien-Wei Chen (Hsinchu, Taiwan), Jie Chen (New Taipei, Taiwan), Ming-Fa Chen (Taichung, Taiwan), Sung-Feng Yeh (Taipei, Taiwan) and Ying-Ju Chen (Yunlin County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die stack structure includes an interconnection structure, a logic die, a control die, a first insulating encapsulant, a dummy die, a memory cube and a second insulating encapsulant. The logic die is electrically connected to the interconnection structure. The logi...