US Patent Issued to Taiwan Aerogel Technology Material on Oct. 21 for "Low thermal conductivity and low-k dielectric aerogel material and preparation method therefor" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,448,294, issued on Oct. 21, was assigned to Taiwan Aerogel Technology Material Co. Ltd. (Tainan, Taiwan).

"Low thermal conductivity and low-k dielectric aerogel material and preparation method therefor" was invented by Jean-Hong Chen (Tainan, Taiwan) and Shiu-Shiu Chen (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention discloses the an aerogel material featuring of low thermal conductivity, low dielectric constant (low-DK) and low dielectric-loss (low-DF) and a preparation method therefor. The method comprises steps of: (1) mix and hydrolysis, (2) dispersion and condensation, (3) molding, and (4) drying. The prepared pu...