ALEXANDRIA, Va., June 5 -- United States Patent no. 12,275,670, issued on April 15, was assigned to Tadatomo SUGA (Tokyo) and iSABers Japan Co. Ltd. (Tokyo).
"Method for joining transparent substrates" was invented by Tadatomo Suga (Tokyo) and Yoshiie Matsumoto (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of bonding transparent substrates is provided, comprising: preparing a pair of transparent substrates; forming a thin film of aluminum oxide by a sputtering method, on a bonding surface of the transparent substrates; contacting the aluminum oxide thin films in the air to bond the pair of transparent substrates; and heating the bonded pair of transparent substrates."
The patent was filed o...