US Patent Issued to Tadatomo Suga, BONDTECH on Sept. 9 for "Substrate bonding method and substrate bonding system" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,409,644, issued on Sept. 9, was assigned to Tadatomo Suga (Tokyo) and BONDTECH Co. LTD. (Kyoto, Japan).

"Substrate bonding method and substrate bonding system" was invented by Akira Yamauchi (Kyoto, Japan) and Tadatomo Suga (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate bonding method for bonding two substrates includes an activation treatment step of, by subjecting at least one of bonding surfaces to be bonded to each other of respective ones of the two substrates to at least one of reactive ion etching using nitrogen gas and irradiation of nitrogen radicals, activating the bonding surface, a gas exposure step of, after the activati...