ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,147, issued on March 25, was assigned to Tadatomo Suga (Tokyo) and BONDTECH Co. LTD. (Kyoto, Japan).
"Bonding system and bonding method" was invented by Akira Yamauchi (Kyoto, Japan) and Tadatomo Suga (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Bonding system that bonds each of a plurality of second articles to a first article, wherein each of the plurality of second articles is a chip comprising an uneven portion on a circumference closer to a bonding surface to be bonded to the first article, the bonding system comprises: a device for supplying a second article that supplies the plurality of second articles; a bond device that bonds the...