ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,045, issued on Aug. 12, was assigned to Tadatomo Suga (Tokyo) and BONDTECH Co. LTD. (Kyoto, Japan).
"Bonding system and bonding method" was invented by Akira Yamauchi (Kyoto, Japan) and Tadatomo Suga (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Bonding system for bonding a second article to a first article, comprising an activation treatment device that comprises an object supporter that supports objects comprising the second article, and a particle beam source that activates a bonding surface of the second article by irradiating the objects with a particle beam, the objects being set on one treatment surface without being opposed to each o...