US Patent Issued to Synopsys on Aug. 26 for "Routing of high-speed, high-throughput interconnects in integrated circuits" (North Carolina, California Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,064, issued on Aug. 26, was assigned to Synopsys Inc. (Mountain View, Calif.).

"Routing of high-speed, high-throughput interconnects in integrated circuits" was invented by Xun Liu (Cary, N.C.) and Jennifer Song Yon Pyon (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes partitioning, within an interposer IC design on which are disposed a first die and a second die, a first bump array into first cluster regions of bumps and a second bump array into second cluster regions of bumps. Creating multiple sub-channels between respective bump cluster regions. Identifying a set of trunk areas positioned between the first bump ...