ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,659, issued on July 29, was assigned to SUPER GROUP SEMICONDUCTOR Co. LTD. (Hsinchu County, Taiwan).
"Power module" was invented by Jen-Jun Su (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module is provided. The power module includes an electrical interconnection assembly and at least one electronic element group. The electrical interconnection assembly includes a conductive structure and a circuit board. The conductive structure includes a first conductive member and a second conductive manner insulated from each other and arranged side by side. The circuit board is disposed on the conductive structure. The circuit...