US Patent Issued to SUNRISE MEMORY on Sept. 2 for "Device with embedded high-bandwidth, high-capacity memory using wafer bonding" (California, Oregon Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,406,966, issued on Sept. 2, was assigned to SUNRISE MEMORY Corp. (San Jose, Calif.).

"Device with embedded high-bandwidth, high-capacity memory using wafer bonding" was invented by Khandker Nazrul Quader (Santa Clara, Calif.), Robert Norman (Pendleton, Ore.), Frank Sai-keung Lee (San Jose, Calif.), Christopher J. Petti (Mountain View, Calif.), Scott Brad Herner (Portland, Ore.), Siu Lung Chan (San Jose, Calif.), Sayeef Salahuddin (Walnut Creek, Calif.), Mehrdad Mofidi (San Jose, Calif.) and Eli Harari (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device with embedded access to a high-bandwidth, high-capacity fast-access ...