US Patent Issued to SUN YAT-SEN UNIVERSITY on Oct. 21 for "Reconfigurable photonic integrated chip based on phase change material film and processing method therefor" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,449,680, issued on Oct. 21, was assigned to SUN YAT-SEN UNIVERSITY (Guangdong, China).

"Reconfigurable photonic integrated chip based on phase change material film and processing method therefor" was invented by Zhaohui Li (Guangdong, China) and Hongfei Chen (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention belongs to the technical field of photonic integrated chips, and more specifically, relates to a reconfigurable photonic integrated chip based on a phase change material film and a processing method therefor. A phase change material film is processed with femtosecond laser and continuous laser to change its surfac...