US Patent Issued to SUMITOMO SEIKA CHEMICALS on Sept. 30 for "Method for producing water absorbent resin particles and aqueous monomer solution" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,427,503, issued on Sept. 30, was assigned to SUMITOMO SEIKA CHEMICALS Co. LTD. (Hyogo, Japan).

"Method for producing water absorbent resin particles and aqueous monomer solution" was invented by Shiho Okazawa (Himeji, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A production method of water-absorbent resin particles is disclosed, the method including: preparing a monomer aqueous solution containing an ethylenically unsaturated monomer and silica; polymerizing the ethylenically unsaturated monomer in the monomer aqueous solution by an aqueous solution polymerization method to obtain a hydrogel-like polymer; and coarsely crushing the hydrogel-lik...