US Patent Issued to SUMITOMO SEIKA CHEMICALS on Nov. 25 for "Method for increasing amount of water absorbed under load by water absorbent resin particles, and method for producing water absorbent resin particles" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,478,952, issued on Nov. 25, was assigned to SUMITOMO SEIKA CHEMICALS Co. LTD. (Hyogo, Japan).

"Method for increasing amount of water absorbed under load by water absorbent resin particles, and method for producing water absorbent resin particles" was invented by Moe Nishida (Himeji, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a method for improving a water absorption amount under load by water absorbent resin particles, the method including shaking a powder containing a plurality of water absorbent resin particles contained in a container. An amount of powder corresponding to a theoretical filling rate of less than 100% may be cont...