US Patent Issued to SUMITOMO SEIKA CHEMICALS on July 8 for "Absorbent resin particles and absorbent" (Japanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,351,692, issued on July 8, was assigned to SUMITOMO SEIKA CHEMICALS Co. LTD. (Hyogo, Japan).

"Absorbent resin particles and absorbent" was invented by Tetsuhiro Kobayashi (Himeji, Japan) and Hiroki Sawaki (Himeji, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to water-absorbent resin particles in which a contact angle of 0.9% by mass saline at 25deg C.plus-minus2deg C. is 100 degrees or larger, and an absorbent material containing the water-absorbent resin particles."

The patent was filed on Dec. 9, 2020, under Application No. 17/757,136.

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