US Patent Issued to SUMITOMO SEIKA CHEMICALS on July 15 for "Method for producing water-absorbent resin particles and water-absorbent resin particles" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,028, issued on July 15, was assigned to SUMITOMO SEIKA CHEMICALS Co. LTD. (Hyogo, Japan).

"Method for producing water-absorbent resin particles and water-absorbent resin particles" was invented by Hiroki Sawaki (Himeji, Japan) and Tomoka Yamamoto (Himeji, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A first embodiment of a method for producing water-absorbent resin particles includes a polymerization step of polymerizing a monomer on at least a part of a surface of a surface-crosslinked polymer particle to obtain a polymer. A second embodiment of a method for producing water-absorbent resin particles includes a polymerization step of polymer...