ALEXANDRIA, Va., June 6 -- United States Patent no. 12,280,578, issued on April 22, was assigned to Sumitomo Osaka Cement Co. Ltd. (Tokyo).
"Method for repairing electrostatic chuck device" was invented by Keisuke Maeda (Tokyo) and Yuuki Kinpara (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for repairing an electrostatic chuck device that is formed by bonding an electrostatic chuck member made of ceramics and a temperature-controlling base member made of metal with a first adhesive layer sandwiched therebetween is provided. The method includes a step of repairing the first adhesive layer that has been eroded by using a cold-curing adhesive."
The patent was filed on Aug. 30, 2021, under Appl...