ALEXANDRIA, Va., March 26 -- United States Patent no. 12,257,759, issued on March 25, was assigned to SUMITOMO HEAVY INDUSTRIES LTD. (Tokyo).
"Film molding device" was invented by Kazuya Hioki (Yokosuka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A film molding device includes: a cooling unit that cools a molding material discharged from a mold; and a rectifying unit that rectifies cooling air blown out from the cooling unit. The rectifying unit includes a suction portion that suctions the cooling air."
The patent was filed on June 6, 2023, under Application No. 18/329,612.
*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1...