ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,057, issued on Oct. 7, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan).
"Semiconductor device and package" was invented by Harutoshi Tsuji (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a conductive base substrate; a semiconductor chip mounted on the base substrate and having a signal pad; a frame configured to surround the semiconductor chip, to be mounted on the base substrate, and to include a step having an inner first upper surface and an outer second upper surface higher than the first upper surface in a plan view, wherein a first conductor pattern provided on the first upper surfa...