US Patent Issued to SUMITOMO ELECTRIC INDUSTRIES on May 20 for "Optical module assembly, optical module, package for optical module and flexible printed board" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,917, issued on May 20, was assigned to SUMITOMO ELECTRIC INDUSTRIES LTD. (Osaka, Japan).

"Optical module assembly, optical module, package for optical module and flexible printed board" was invented by Taichi Misawa (Osaka, Japan) and Keiji Tanaka (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package for an optical module includes a substrate that includes a first wiring layer, a second wiring layer, and a third wiring layer. The package includes a first insulating layer between the first wiring layer and the second wiring layer, the first insulating layer including first vias. The package includes a second insulating layer between ...