US Patent Issued to Sumitomo Electric Industries on Dec. 30 for "Semiconductor device and method of manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,929, issued on Dec. 30, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan).

"Semiconductor device and method of manufacturing the same" was invented by Yutaka Moriyama (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor device includes preparing a first substrate provided with a first pattern on a first surface, and a semiconductor chip having a second surface, and a third surface opposite to the second surface, and including a second pattern provided on the second surface, recognizing the first pattern from a position near the first surface among the first surface and an opposite sur...