US Patent Issued to SUMITOMO ELECTRIC INDUSTRIES on April 8 for "Optical module assembly, optical module, package for optical module and flexible printed board" (Japanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,273,991, issued on April 8, was assigned to SUMITOMO ELECTRIC INDUSTRIES LTD. (Osaka, Japan).

"Optical module assembly, optical module, package for optical module and flexible printed board" was invented by Taichi Misawa (Osaka, Japan) and Keiji Tanaka (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package for an optical module includes a substrate provided through a side wall in a first direction. The substrate includes a first wiring layer including a first signal terminal, a second signal terminal, and a first ground terminal. The package includes a second wiring layer disposed under the first wiring layer. The second wiring layer inc...