US Patent Issued to Sumitomo Electric Industries on April 29 for "Diamond composite body, substrate, diamond, tool including diamond, and method for manufacturing diamond" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,726, issued on April 29, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan).

"Diamond composite body, substrate, diamond, tool including diamond, and method for manufacturing diamond" was invented by Yoshiki Nishibayashi (Itami, Japan), Natsuo Tatsumi (Itami, Japan) and Hitoshi Sumiya (Itami, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a diamond composite body capable of shortening a separation time for separating a substrate and a diamond layer, the substrate, and a method for manufacturing a diamond, as well as a diamond obtained from the diamond composite body and a tool including the diamond. The diamond compos...