ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,432, issued on Jan. 27, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan) and SUMITOMO ELECTRIC PRINTED CIRCUITS INC. (Shiga, Japan).

"Printed wiring board" was invented by Masamichi Yamamoto (Osaka, Japan), Kayo Hashizume (Osaka, Japan), Issei Okada (Osaka, Japan), Kenichiro Aikawa (Shiga, Japan) and Yoshio Oka (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board includes a base film having a first major surface provided with a groove, and a wiring line disposed in the groove. The wiring line includes a metal particle layer disposed at least on a bottom surface of the groove and a plating layer disposed...