US Patent Issued to Sumitomo Electric Industries, A.L.M.T. on March 18 for "Composite material, heat sink and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,252,766, issued on March 18, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan) and A.L.M.T. Corp. (Tokyo).

"Composite material, heat sink and semiconductor device" was invented by Masatoshi Majima (Osaka, Japan), Gouhei Toyoshima (Yamagata, Japan) and Kouichi Takashima (Yamagata, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composite material of the present disclosure contains a plurality of diamond particles, copper, and at least one first element selected from the group consisting of silicon, chromium, cobalt, nickel, molybdenum, titanium, vanadium, niobium, tantalum tungsten and aluminum, wherein the content rate of the firs...