US Patent Issued to Sumitomo Electric Industries, A.L.M.T. on Jan. 13 for "Composite material, heat spreader and semiconductor package" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,503, issued on Jan. 13, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan) and A.L.M.T. Corp. (Tokyo).

"Composite material, heat spreader and semiconductor package" was invented by Toru Maeda (Osaka, Japan), Miki Miyanaga (Osaka, Japan), Daisuke Kondo (Osaka, Japan), Masayuki Ito (Yamagata, Japan) and Shin-ichi Yamagata (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composite material includes a plurality of first layers and a plurality of second layers. The total number of the first and second layers is 5 or more. The first and second layers are stacked alternately in the thickness direction of the composite material,...