US Patent Issued to Sumitomo Electric Device Innovations on Nov. 4 for "Semiconductor device and semiconductor device manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,119, issued on Nov. 4, was assigned to Sumitomo Electric Device Innovations Inc. (Yokohama, Japan).

"Semiconductor device and semiconductor device manufacturing method" was invented by Akira Sahashi (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a package having a top surface and a bottom surface; a semiconductor element arranged in the package; and a base which is arranged in the package and on which the semiconductor element is mounted. A top surface of the base is exposed to the top surface of the package, and a bottom surface of the base is exposed to the bottom surface of the package."

The paten...