US Patent Issued to SUMITOMO ELECTRIC DEVICE INNOVATIONS on Nov. 11 for "Semiconductor device, monolithic microwave integrated circuit, semiconductor package, and method of manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,804, issued on Nov. 11, was assigned to SUMITOMO ELECTRIC DEVICE INNOVATIONS INC. (Kanagawa, Japan).

"Semiconductor device, monolithic microwave integrated circuit, semiconductor package, and method of manufacturing semiconductor device" was invented by Keita Matsuda (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor substrate, a semiconductor element formed on the semiconductor substrate, a first insulating film covering the semiconductor element, a second insulating film formed on the first insulating film, and a third insulating film formed on the second insulating film. The first and t...