ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,921, issued on Sept. 16, was assigned to Sumitomo Chemical Co. Ltd. (Tokyo).
"Epoxy resin composition and cured product thereof" was invented by Kenichi Takeuchi (Osaka, Japan) and Hirofumi Kato (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an epoxy resin composition containing an epoxy resin (A), a curing agent (B) and an imidazole adduct-type curing accelerator (C), in which the curing agent (B) contains a compound (B-1) represented by formula (B-1) [R1 represents a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms] and a compound (B-2) represented by formula (B-2) [R2 rep...