US Patent Issued to Sumitomo Chemical on Feb. 4 for "Sputtering target, method of bonding target material and backing plate, and method of manufacturing sputtering target" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,217,948, issued on Feb. 4, was assigned to Sumitomo Chemical Co. Ltd. (Tokyo).

"Sputtering target, method of bonding target material and backing plate, and method of manufacturing sputtering target" was invented by Masahiro Fujita (Osaka, Japan) and Koji Nishioka (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sputtering target comprising: a backing plate; and a target material bonded via a bonding material to a bonding region of the backing plate, wherein a bonding area of a bonding portion between the target material and the backing plate accounts for 97% or more of the area of the bonding region, and wherein a maximum defect area of por...