ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,592, issued on Feb. 3, was assigned to Sumitomo Chemical Co. Ltd (Tokyo).
"Thermally conductive material for electronic devices" was invented by Martin Humphries (Godmanchester, Great Britain), Simon King (Godmanchester, Great Britain), Thomas Fletcher (Godmanchester, Great Britain), Antonio Attanzio (Godmanchester, Great Britain) and Kiran Kamtekar (Godmanchester, Great Britain).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electrically non-conducting film (109) comprising an oligomer comprising an arylene or heteroarylene repeating unit is disposed between a chip (105), e.g. a flip-chip, and a functional layer (101), e.g. a printed circuit board...