US Patent Issued to SUMCO on Sept. 2 for "Wafer separation apparatus and method, and method for manufacturing silicon wafer" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,406,863, issued on Sept. 2, was assigned to SUMCO Corp. (Tokyo).

"Wafer separation apparatus and method, and method for manufacturing silicon wafer" was invented by Tomohiro Hashii (Tokyo), Tsukasa Yoshihara (Tokyo), Yasunori Yoshioka (Tokyo), Kawahito Shinichi (Tokyo) and Sumihisa Masuda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "It would be helpful to provide a wafer separation apparatus and method, and a method for manufacturing a silicon wafer in which poor wafer separation can be easily prevented. A wafer separation apparatus 1 includes an injection port 2 configured to inject a fluid, a rolling element 3, and a holder 4 configured to mo...