US Patent Issued to STMicroelectronics S.r.l on Jan. 27 for "Method of manufacturing semiconductor devices and corresponding semiconductor device" (Italian Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,809, issued on Jan. 27, was assigned to STMicroelectronics S.r.l (Agrate Brianza, Italy).

"Method of manufacturing semiconductor devices and corresponding semiconductor device" was invented by Mauro Mazzola (Calvenzano, Italy) and Fabio Marchisi (Milan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device semiconductor chip mounted to a leadframe that includes an electrically conductive pad. An electrically conductive clip is arranged in a bridge-like position between the semiconductor chip and the electrically conductive pad. The electrically conductive clip is soldered to the semiconductor chip and to the electrically conductive pa...