US Patent Issued to STMicroelectronics on Sept. 23 for "Method of manufacturing semiconductor devices and corresponding semiconductor device having vias and pads formed by laser" (Italian Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,521, issued on Sept. 23, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy).

"Method of manufacturing semiconductor devices and corresponding semiconductor device having vias and pads formed by laser" was invented by Michele Derai (Milan) and Dario Vitello (Merate, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "A System in Package, SiP semiconductor device includes a substrate of laser direct structuring, LDS, material. First and second semiconductor die are arranged at a first and a second leadframe structure at opposite surfaces of the substrate of LDS material. Package LDS material is molded onto the second surface of the su...