US Patent Issued to STMicroelectronics on Sept. 23 for "Capless semiconductor package with a micro-electromechanical system (mems)" (Philippine Inventor)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,421,108, issued on Sept. 23, was assigned to STMicroelectronics Inc. (Calamba, Philippines).

"Capless semiconductor package with a micro-electromechanical system (mems)" was invented by Jefferson Sismundo Talledo (Calamba, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package that contains an application-specific integrated circuit (ASIC) die and a micro-electromechanical system (MEMS) die. The MEMS die and the ASIC die are coupled to a substrate that includes an opening that extends through the substrate and is in fluid communication with an air cavity positioned between and separating the MEMS die from the substrate. The ...