US Patent Issued to STMicroelectronics on Oct. 28 for "Method of producing substrates for semiconductor device packages comprising anchoring encapsulation to die pad" (Italian Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,629, issued on Oct. 28, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy).

"Method of producing substrates for semiconductor device packages comprising anchoring encapsulation to die pad" was invented by Mauro Mazzola (Calvenzano, Italy) and Roberto Tiziani (Nerviano, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pre-molded leadframe includes a laminar structure having empty spaces therein and a first thickness with a die pad having opposed first and second die pad surfaces. Insulating pre-mold material is molded onto the laminar structure. The pre-mold material penetrates the empty spaces and provides a laminar pre-molded s...