US Patent Issued to STMicroelectronics on Nov. 4 for "Semiconductor device and assortment of semiconductor devices with electrically conductive ribbon configurations" (Italian Inventor)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,170, issued on Nov. 4, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy).

"Semiconductor device and assortment of semiconductor devices with electrically conductive ribbon configurations" was invented by Mauro Mazzola (Calvenzano, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a pre-molded leadframe mounting substrate. The substrate includes a die pad (configured to have a semiconductor die mounted thereon) and a first electrically conductive pad and a second electrically conductive pad. A strip of insulating material is molded between the first and second electrically conductive pads to provide a...