US Patent Issued to STMicroelectronics on May 13 for "Semiconductor device with electrical component for bridging leadframe and chip mounting portion and corresponding method of manufacture" (Italian Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,585, issued on May 13, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy).

"Semiconductor device with electrical component for bridging leadframe and chip mounting portion and corresponding method of manufacture" was invented by Alberto Arrigoni (Eupilio, Italy), Giovanni Graziosi (Vimercate, Italy) and Aurora Sanna (Milan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is a method for manufacturing a semiconductor product package. The method includes arranging a leadframe with one or more leads such that each lead has an inner end facing a portion of a die-pad, attaching a semiconductor chip to the die-pad, attaching ...