US Patent Issued to STMICROELECTRONICS on May 13 for "Process for manufacturing a combined microelectromechanical device and corresponding combined microelectromechanical device" (Italian Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,099, issued on May 13, was assigned to STMICROELECTRONICS S.r.l. (Agrate Brianza, Italy).

"Process for manufacturing a combined microelectromechanical device and corresponding combined microelectromechanical device" was invented by Federico Vercesi (Milan), Luca Seghizzi (Milan), Laura Oggioni (Milan) and Lorenzo Corso (Ruginello, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "A process for manufacturing a combined microelectromechanical device includes forming, in a die of semiconductor material, at least a first and a second microelectromechanical structure, performing a first bonding phase to bond a cap to the die via a bonding region or ad...