US Patent Issued to STMICROELECTRONICS on March 18 for "Method for manufacturing leadless semiconductor package with wettable flanks" (Philippine Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,076, issued on March 18, was assigned to STMICROELECTRONICS INC. (Calamba, Philippines).

"Method for manufacturing leadless semiconductor package with wettable flanks" was invented by Ian Harvey Arellano (Bauang, Philippines), Aaron Cadag (Calamba, Philippines) and Ela Mia Cadag (Calamba, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to leadless semiconductor packages with improved wettable flanks that encourage the formation of solder fillets when the leadless semiconductor package is mounted to a substrate. The solder fillets are consistently formed and are easily detectable by inspection systems, s...