US Patent Issued to STMicroelectronics on June 17 for "Method for manufacturing a SiC electronic device with reduced handling steps, and sic electronic device" (Italian Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,346, issued on June 17, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy).

"Method for manufacturing a SiC electronic device with reduced handling steps, and sic electronic device" was invented by Simone Rascuna' (Catania, Italy), Paolo Badala' (Acireale, Italy), Anna Bassi (Gravina di Catania, Italy), Mario Giuseppe Saggio (Aci Bonaccorsi, Italy) and Giovanni Franco (Viagrande, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing an electronic device based on SiC includes forming a structural layer of SiC on a front side of a substrate. The substrate has a back side that is opposite to the front side along...