US Patent Issued to STMICROELECTRONICS on July 8 for "Wafer level chip scale package having varying thicknesses" (Singaporean Inventor)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,986, issued on July 8, was assigned to STMICROELECTRONICS PTE LTD (Singapore).

"Wafer level chip scale package having varying thicknesses" was invented by Jing-En Luan (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer level chip scale package (WLCSP) with portions that have different thicknesses. A first passive surface of a die in the WLSCP includes a plurality of surfaces. The plurality of surfaces may include inclined surfaces or flat surfaces. Thicker portions of die, with more semiconductor material remaining are non-critical portions that increase a WLCSP's strength for further processing and handling after formation, and the th...