US Patent Issued to STMICROELECTRONICS on July 8 for "Packaged electronic system formed by electrically connected and galvanically isolated dice" (Italian Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,998, issued on July 8, was assigned to STMICROELECTRONICS S.r.l. (Agrate Brianza, Italy).

"Packaged electronic system formed by electrically connected and galvanically isolated dice" was invented by Dario Paci (Vittuone, Italy), Silvia Adorno (Novate Milanese, Italy), Marco Del Sarto (Monza, Italy), Fabrizio Cerini (Magenta, Italy) and Alex Gritti (Vimercate, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged electronic system having a support formed by an insulating organic substrate housing a buried conductive region that is floating. A first die is fixed to the support and carries, on a first main surface, a first die contact region c...