US Patent Issued to STMICROELECTRONICS on July 29 for "Method of producing electronic components, corresponding electronic component" (Italian Inventor)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,606, issued on July 29, was assigned to STMICROELECTRONICS S.r.l. (Agrate Brianza, Italy).

"Method of producing electronic components, corresponding electronic component" was invented by Fabio Marchisi (Milan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of producing electronic components including at least one circuit having coupled therewith electrical connections including metallic wire bondable surfaces encased in a packaging, the method including bonding stud bumps, in particular copper stud bumps, at determined areas of said wire bondable surfaces."

The patent was filed on March 4, 2024, under Application No. 18/594,699.

*For furth...