US Patent Issued to STMICROELECTRONICS on July 22 for "Package with polymer pillars and raised portions" (Singaporean Inventor)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,125, issued on July 22, was assigned to STMICROELECTRONICS PTE LTD (Singapore).

"Package with polymer pillars and raised portions" was invented by Jing-En Luan (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to semiconductor packages that include a molding compound having at least one raised portion that extends outward from the package. In some embodiments, the semiconductor packages have a plurality of raised portions, and a plurality of conductive layers are on the plurality of raised portions. The plurality of raised portions and the plurality of conductive layers are utilized to mount the semiconduct...