US Patent Issued to STMicroelectronics on July 22 for "Method of manufacturing multi-die semiconductor devices and corresponding multi-die semiconductor device" (Italian Inventor)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,055, issued on July 22, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy).

"Method of manufacturing multi-die semiconductor devices and corresponding multi-die semiconductor device" was invented by Paolo Crema (Vimercate, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "An multi-die semiconductor device disclosed herein includes a metallic leadframe with a central die pad encircled by electrically-conductive leads. Mounted on the die pad are two semiconductor dice, each with dedicated bonding pads on the surfaces facing away from the die pad. A layer of laser-activatable material is precisely molded over the dice and the leadfram...