US Patent Issued to STMICROELECTRONICS on July 22 for "High thermal dissipation, packaged electronic device and manufacturing process thereof" (Italian Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,126, issued on July 22, was assigned to STMICROELECTRONICS S.r.l. (Agrate Brianza, Italy).

"High thermal dissipation, packaged electronic device and manufacturing process thereof" was invented by Cristiano Gianluca Stella (San Gregorio di Catania, Italy) and Roberto Rizza (Syracuse, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "The packaged power electronic device has a bearing structure including a base section and a transverse section extending transversely to the base section. A die is bonded to the base section of the bearing structure and has a first terminal on a first main face and a second and a third terminal on a second main face. A...