US Patent Issued to STMicroelectronics on Jan. 13 for "Integrated circuit chip package that does not utilize a leadframe" (Singaporean Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,564, issued on Jan. 13, was assigned to STMicroelectronics PTE LTD (Singapore).

"Integrated circuit chip package that does not utilize a leadframe" was invented by Jing-En Luan (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit die includes a semiconductor substrate, an interconnect layer including bonding pads, and a passivation layer covering the interconnect layer and including openings at the bonding pads. A conductive redistribution layer including conductive lines and conductive vias is supported by the passivation layer. An insulating layer covers the conductive redistribution layer and the passivation layer. Chan...